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PCB Board Manufacturing Tutorial

PCB Board Manufacturing Tutorial 

Our goal is to make this the easiest online tutorial for learning how printed circuit boards are manufactured. There are several unique steps in the PCB manufacture process. This circuit board manufacture tutorial is meant to familiarize you with those steps.
Scroll down to view the steps in the circuit board manufacturing process.

Steps in PCB Circuit Board Manufacturing

Step#1 Film Generation:
Generated from your design files, we create an exact film representation of your design. We will create one film per layer.
Từ file thiết kế, tạo ra các lớp film
Step 1
Step#2 Shear Raw Material:
Industry standard 0.059" thick, copper clad, two sides. Panels will be sheared to accommodate many boards.
Chuẩn bị board đồng, cắt ra hình dạng mạch cần làm. (Có thể cắt 1 lúc nhiều board, số lượng, kích thước board còn phụ thuộc vào việc SMT sau này)
Step 2
Step#3 Drill Holes:
Using NC machines and carbide drills.
Khoan lỗ(holes,vias) sử dụng máy NC
Step 3
Step#4 Electroless Copper:
Apply thin copper deposit in hole barrels.

Step 4
Step#5 Apply Image:
Apply photosensitive dryfilm (plate resist) to panel. Use light source and film to expose panel. Develop selected areas from panel.
Phủ 1 lớp photoresist lên board. Sau đó lại đặt lên 1 film để che đi những phần đồng không bị ăn mòn(track, hole, via). Dùng máy chiếu UV công suất lớn để ăn mòn lớp photoresist. Sau cùng, ta có 1 lớp photoresist đã bị ăn mòn những phần ko cần thiết lớp này phủ lên trên lớp đồng. (Nếu nhúng cả board vào dung dịch ăn mòn đồng, ta được mạch như bên hình)
More

Step 5
Step#6 Pattern Plate:
Electrochemical process to build copper in the holes and on the trace area. Apply tin to surface.
Qúa trình điện hóa học sẽ tạo phần vật liệu đồng ở trong các hole và trên các đường mạch. Sau đó phủ thiếc lên toàn bộ bề mặt.
Step 6
Step#7 Strip & Etch:
Remove dryfilm, then etch exposed copper. The tin protects the copper circuitry from being etched.
Bỏ dryfilm ra, ăn mòn đồng. Thiếc sẽ bảo vệ các đường mạch không bị ăn mòn.
Step 7
Step#8 Solder mask:
Apply solder mask area to entire board with the exception of solder pads.
Đặt thêm 1 cái mặt nạ lên toàn bộ bo mạch để chuẩn bị cho việc phủ thiếc hàn lên các pads
Step 8
Step#9 Solder coat:
Apply solder to pads by immersing into tank of solder. Hot air knives level the solder when removed from the tank.
Phủ thiếc hàn lên các pad bằng cách nhúng toàn bộ mạch vào 1 cái bể chứa thiếc hàn.
Step 9
Step#10 Nomenclature:
Apply white letter marking using screen printing process.
In lớp tên linh kiện và hình dạng linh kiện

Step#11 Fabrication:
Route the perimeter of the board using NC equipment.

Step 10

Thank to: http://www.sunstone.com/Customer-solutions/pcb-manufacturing-tutorial.aspx
More about multilayer PCB manufacturing step by step:
http://www.eurocircuits.com/index.php/making-a-pcb-eductional-movies

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